Apple's MacBook Pro will have a 3nm M2 Pro chip by TSMC later this year

A new report claims that the Taiwan Semiconductor Manufacturing Company may be able to manufacture 3nm chips for Apple by the end of the year due to the introduction of its new technology.

As a result of the new 3nm processor, the Cupertino company could become the first to design chips based on the M2 Pro chipsets.

Furthermore, according to the report, Apple's upcoming A17 Bionic chip, and the upcoming M3 chip, may be able to utilize TSMC's 3nm process for the foreseeable future.

There is a high likelihood that the switch to the 3nm process from the 5nm process used by TSMC will improve performance and energy efficiency.

TSMC has reported that Apple will use its 3nm manufacturing process for the M2 Pro chip, expected to be included with its new lineup of MacBook Pro laptops ranging from 14-inches to 16-inches, which is said to be released soon.

The report was come to light by Taiwan's Commercial Times. Those MacBook Pro laptops will probably be available later this year or as early as 2023, depending on the release date.

As mentioned in the report, a new high-end Mac Mini could also come with the M2 Pro chip as part of the new system.

Next year's iPhone 15 Pro models are expected to be built using the three-nanometer process from TSMC if Apple opts to use it for its A17 Bionic chip.

As a future generation of MacBook Air and MacBook Pro models are being developed, this technology could also be used for the M3 chip for the new MacBook Air and MacBook Pro models.

As compared to the chips manufactured using TSMC's 5nm process, the M2 Pro chips manufactured using a 3nm process are expected to offer faster performance and greater energy efficiency when compared with the ones manufactured using the 3nm process.

There is a possibility that future Macs and iPhones will be able to provide increased battery life as a result.

Apple is expected to be the first to use TSMC's 3nm chips by the end of this year, as it will be the first to use the devices.

As a result, it appears that companies such as Intel, Super Micro, Huida, Qualcomm, MediaTek, Broadcom, and others will be able to get their hands on 3nm chips next year.

After completely transitioning to TSMC's Zen 5 architecture or the next year after that, AMD is also expected to use TSMC's 3nm process for some of its products to remain competitive.