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Foxconn's IC fab capacity is expected to be online by 2023

Mobiles

Foxconn's IC fab capacity is expected to be online by 2023

Hon Hai Precision Industry (Foxconn) anticipates opening its automotive chips and third-generation semiconductor fabs in 2023.

On May 12, Foxconn Chairman Young-way Liu announced new goals for EVs, semiconductors, and B5G network communications in the next three years, while emphasizing the company's mid-to-long-term target of 10% gross margin.

Liu pointed out that Foxconn has completed EV-related project construction and deployment over the past three years, as well as completed diversified industry cooperation with various players around the world.

Foxconn's goal is to hold 5% of the EV market by 2025 and achieve revenue of NT$1 trillion (US$34.49 billion). Foxconn hopes to produce 500,000-750,000 units annually.

Those investments amount to NT$15 billion in 2021 and 2022, according to Liu, for Foxconn's EV development plans. Through its innovative build-operate-localize (BOL) business model, Foxconn will be able to convince relevant global industry players it is a contender in the EV field.

Foxconn’s 3+3 semiconductor strategy continues to serve Foxconn’s semiconductor needs, according to Liu. It is also increasing its development of automotive semiconductor products along with increasing its production capacity.

Hon Hai Research Institute (HHRI) will help the company implement its next-generation technology plans in the next five to seven years.

Liu said Foxconn plans to provide electric vehicle and information and communications customers with platform solutions by combining self-designed semiconductors with in-house and outsourced production capacity in the next three years.

The mass production of key automotive ICs based on Silicon Carbide (SiC) is expected to begin in 2023, automotive microcontroller units (MCU) will begin casting in 2024, and optical phased array (OPA) and inverter SiC power modules are expected to begin mass production in 2024.

Foxconn will also pursue the development of an extensive portfolio of medium and high-voltage power components to achieve mass production of automotive power management ICs (PMICs) in 2024.

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